Thermal Design Solutions is a thermal management consulting firm that serves worldwide clients in thermal design of electronics. With decades of experience in the field, we are experts in all aspects of electronics cooling solutions. From chip-level thermal design, to large system, we help companies achieve optimal, reliable and cost effective thermal solutions.
Thermal Design Solutions was founded by Dr. Mulugeta Berhe, who is one of leading specialists in thermal management of electronics. He has more than 25 years of experience in the field, working for some of the biggest names in the industry, including Intel Corporation, Microsoft Corporation, Qualcomm Inc, Ansys Inc, and Henkel.
At Ansys (Fluent Inc.), he was a member of the first Icepak development and support team. He trained and supported hundreds of thermal engineers during those years. Later, he also worked as the lead thermal consultant, helping various companies with thermal analysis and design.
At Intel Corporation, Dr. Berhe worked on several mobile systems, including smartphones and high power notebooks. In this role, he became the leading authority in thermal ergonomics, conducting several of the first studies in touch comfort for handheld devices. Later, he also worked on mobile and desktop healthcare products, as well as on microprocessor analysis and design.
At Microsoft, he was part of a team in charge of smartphones and wearables design and development. In this role, he handled some extremely challenging thermal issues related with the development of post-smartphone devices.
At Henkel, he led the Thermal Engineering team charged with the development and marketing of PCM-based energy storage solutions and interface materials.
Dr. Berhe holds Ph.D. degree from the University of Minnesota, Minneapolis, in Mechanical Engineering. He completed his Ph.D. under the supervision of Prof. Patankar, specializing in thermal analysis, modeling and design. He is the author of several journal publications and conference papers, as well as a holder of several patents. He obtained M.A.Sc. degree from the University of Toronto in Canada, where he also worked in fossil and nuclear power plant analysis and design at Ontario Hydro and Atomic Energy of Canada.
Dr. Berhe has worked on many projects varying in scale and type over the years. He has worked from micron level issues such as copper traces within a die, to as big as power plant systems – all dealing with thermal analysis, modeling and design. This broad and extensive experience has given him a deeper and more complete understanding of this area of thermal engineering.
For questions or further information, please contact us by filling the contact us form or send email to info@ThermalDS.com.